Apex Hybrid

Uncompromised Clarity

Speed and Accuracy in Imaging

Next Generation Interconnect Ready
Flexibility – High Capacity or High Resolution
>100x Faster Data Acquisition on Large PCBs
Dual Mode Imaging (Laminography + Tomography)

Apex-Hybrid addresses the challenges in the semiconductor failure analysis, in which time-consuming sample preparation and imaging workflows can slow down urgent projects. Apex-Hybrid is designed to remove these inconveniences, allowing seamless switching between Laminography mode and Tomography mode, giving comprehensive, high-quality imaging for samples ranging from large PCBs and wafers to smaller chiplets.

Figure: A memory device was acquired at 270 nm in tomography mode on the Apex-Hybrid. Fine details, such as burrs, are visible, and a ~1 µm defect is clearly resolved.

Apex-Hybrid combines the strengths of Sigray’s Apex laminography product and its EclipseXRM product in a single system.

  • In laminography mode, it creates clean, artifact-free virtual cross-sections and layers of large, uncut samples like printed circuit boards (PCBs), wafers, and panels.
  • In tomography mode, it provides highly detailed cross-sectional images, making it ideal for combining with other types of microscopy and for measurements across different scales.

For maximum resolution and for cases in which the majority of samples are cylindrical, check out our EclipseXRM solution! And if you need help deciding between systems, contact us at [email protected].

Achieve 350 nm spatial resolution

Apex-Hybrid has a unique geometry where, irrespective of the imaging mode, it provides industry-leading 350 nm resolution for precise analysis of next-generation interconnects. This allows ultimate flexibility to visualize Cu-Cu hybrid bonds, small through-silicon vias (TSVs), and thin interposer layers, otherwise inaccessible to 3D X-ray.

Figure: 3D Resolution – Tomography of a NTT resolution standard with line pairs, showing <0.4 µm (<400 nm) spatial resolution capabilities.
The image was acquired in laminography mode on the Apex-Hybrid.
Figure: Large array of 5 µm diameter TSVs on a 300 mm wafer. The full FOV appears in the left image, while bridging—
highlighted with teal dotted circles—is visible in the three zoomed-in images on the right.
Software and Automation: XRM Companion and GigaRecon
GigaRecon | Powerful Reconstruction

GigaRecon | Tomographic reconstruction software that pairs the fastest reconstruction times with an unmatched suite of features to achieve the best result every time. Reconstruction speeds of <45 seconds are achieved for 2048 x 2048 x 2200 datasets. GigaRecon provides the fastest iterative tomography reconstruction on the market, enabling high-quality image reconstruction with 5X shorter data collection time, substantially accelerating tomography imaging time over conventional FDK reconstruction.

XRM Companion | Intuitive Acquisition
  • Easy, intuitive software that supports Python and open file formats
  • Automatic scan execution and scan recipe support
  • Queue up to 10 samples with the automated Sample Handling Robot (SHR)
GigaRecon provides high quality data with far fewer views required
XRM Companion features an intuitive GUI for acquiring and measuring data
Precision Angle Laminography (PAL)

We recognize the compromises made to image large flat samples. Apex-Hybrid builds on the highly-successful & fab-tested Apex product family, designed from the ground-up to maximize throughput and deliver the highest quality images in a slanted-angle geometry. Sigray’s unique technology puts physics first, maximizing contrast and minimizing air gaps for the cleanest, clearest radiographs in 2.5D and 3D inspection. Learn more about the air- bearing stage in the White Paper.


Figure – Sigray’s Patented PAL (Precision Angle Laminography) architecture allows high-quality laminographic imaging.
Left Image: Traditional laminography produces angled “streak” artifacts (red arrows), which make it difficult to measure stand-off heights (SOH) and distinguish RDL layers.
Right Image: Apex-Hybrid’s PAL minimizes the presence of laminographic artifacts, making RDL layers clearer. A blue arrow highlights a void that is more visible at this angle and might have been missed at a higher slant.

System Features

Nanofocus Transmission X-ray Source

A state-of-the-art Nanofocus open X-ray source combines highest power and spatial resolution. The novel X-ray source has a patterned target that is used for internal alignment, so the need for the external targets is eliminated. Additionally, the X-ray tube offers long life cathode that lasts for several thousands of hours reducing total cost of ownership. Download the White Paper to learn more.

High Efficiency Detectors

Your imaging needs for speed and FOV may vary. Apex-Hybrid offers a choice of detectors that speed imaging by 20x . Contact us to learn more about the detector options and our Montage Package to create seamless, large-scale 3D datasets.


Applications

Microbump, C4, and Solder Joint Inspection

Modern devices are requiring increased density of components, which continues to place heavy demands on small feature sizes, small pitch layouts, and high reliability of the connections. The multi-scale nature of these devices presents remarkable challenges for conventional characterization, where small features can typically only be accessed through extensive and time-consuming sample preparation, introducing additional uncertainties in the results. With Apex-Hybrid, the computed laminography (CL) mode can be used to inspect an intact device fresh from the factory line or RMA queue, and subsequent ROIs may be identified for computed tomography (CT) mode inspection or further downstream processing with FIB, TEM, or other destructive sectioning techniques. Apex-Hybrid places 3D X-ray at the helm of your inspection workflows, adding 3D non-destructive imaging alongside other first-pass techniques (e.g., C-SAM, electrical testing, etc.).

The Apex-Hybrid system delivers superior image quality and resolution compared to other leading systems. This image shows the same sample captured in laminography mode on the Apex-Hybrid using its patented PAL approach. Red arrows highlight defects clearly detected with the Apex-Hybrid.

Fine-Pitch Interconnects in Advanced Package

With the rise of AI and process-heavy computational demands, chip architectures have continued to scale to smaller dimensions, to pack more processing power into a small size form-factor. Apex-Hybrid is an ideal solution to meet the increasingly demanding requirements on metrology tool resolution and repeatability metrics – with resolution down to the few hundreds of nanometers, Apex-Hybrid provides the ideal solution for scalable non-destructive inspection to meet the growing demands of FA and R&D laboratories.

Zoom-in on 5 µm interconnects in an advanced package test vehicle. Several bridges are noted between the finely-structured, high-aspect ratio vias.
High Bandwidth Memory: Next-Generation CPU with HBM L3 Cache

Modern CPUs are now integrating on-board high-bandwidth memory devices, providing exceptional acceleration for AI & machine learning, graphical processing, and high-performance computing (HPC). The small size makes them exceptionally challenging to characterize with conventional techniques; with Apex Hybrid, however, users are equipped with the nano-scale spatial resolution and flexible sample handling requirements inherent in HBM integrations. Intact devices may be inspected using CL mode, while precise characterizations on prepared sections may be subsequently carried out using CT mode. Apex Hybrid offers the ultimate non-destructive 3D imaging capabilities to address challenging HBM applications.

3D X-ray virtual cross-sections through L3 Cache die within a modern CPU. Tiny microbumps and Cu-Cu hybrid bonds can be clearly seen extending above the C4 bumps in this orientation.
Failure Analysis and Reverse Engineering of Intact Large Packages

Imaging large, intact packages has become essential for failure analysis laboratories of device companies, especially with the rise of 3D Heterogeneous Integration (3DHI). Apex Family provides best-in-class performance —delivering the highest resolution at high throughput—to progressively image intact devices and boards at submicron (<0.3 µm) resolution.

For more examples of Sigray’s powerful capabilities in semiconductor, visit our page on semiconductor applications.

Progressive zoom-in of iPhone 14 Pro at 8um to 1um
A selected ROI (Region 1) of an iPhone 14Pro acquired at 4um. This image was used to identify additional regions of interest for higher resolution (e.g., 1um voxel) imaging.

Technical Specifications of the Apex Hybrid

 ParameterSpecification
OverallPixel Resolution<100 nm pixel resolution
Spatial Resolution400 nm spatial resolution (350 nm achievable)
Imaging ModesTransmission
PAL (Precision Angle Laminography)
SourceTypeOpen transmission x-ray tube with long-lifetime and internal resolution calibration
Max Voltage160 kV
TargetMicrostructured Tungsten on diamond
X-ray DetectorsTypeHyperCapture - Standard Flat Panel detector: 7MP with 50 µm pixels
Larger format (13MP) or smaller pixel (16MP) available upon request.
StagesState-of-the-art Air Bearing rotary stage with minimal runout
Sample positioning stage with 100 x 20 x 100 mm XYZ travel (standard)
AutomationTypeIn-system Sample Robot
Sample Dimensions10 samples of 100 x 100 mm dimensions
WorkstationsLinux-based Control Workstation
Windows-based Analysis Workstation
SoftwareAcquisitionSigray3D Intuitive Software
ReconstructionSigray GigaRecon - Fastest reconstruction algorithm on the market.
FormatOpen-source Controls and Open-source
OptionalAuto-Recon Package and MegaView Montage
Advanced AnalysisOptional Comet Dragonfly and/or Avizo Data Analysis

Downloads

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